Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections

Langbeschreibung
Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections provides a detailed description of the application of finite element methods (FEMs) to the study of ULSI interconnect reliability. Over the past two decades the application of FEMs has become widespread and continues to lead to a much better understanding of reliability physics.To help readers cope with the increasing sophistication of FEMs¿ applications to interconnect reliability, Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections will:introduce the principle of FEMs;review numerical modeling of ULSI interconnect reliability;describe the physical mechanism of ULSI interconnect reliability encountered in the electronics industry; anddiscuss in detail the use of FEMs to understand and improve ULSI interconnect reliability from both the physical and practical perspective, incorporating the Monte Carlo method.A full-scale review of the numerical modeling methodology used in the study of interconnect reliability highlights useful and noteworthy techniques that have been developed recently. Many illustrations are used throughout the book to improve the reader¿s understanding of the methodology and its verification. Actual experimental results and micrographs on ULSI interconnects are also included.Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections is a good reference for researchers who are working on interconnect reliability modeling, as well as for those who want to know more about FEMs for reliability applications. It gives readers a thorough understanding of the applications of FEM to reliability modeling and an appreciation of the strengths and weaknesses of various numerical models for interconnect reliability.
Hauptbeschreibung
Gives readers a thorough understanding of the application of finite element methods to reliability modelling
Inhaltsverzeichnis
1. Introduction.- 2. Development of Physics-based Modeling for ULSI Interconnections Failure Mechanisms: Electromigration and Stress Induced Voiding.- 3. Introduction and General Theory of Finite Element Method.- 4. Finite Element Method for Electromigration Study.- 5. Finite Element Method for Stress Induced Voiding.- 6. Finite Element Method for Dielectric Reliability.
Dr Tan is a member of the academic staff at the Nanyang Technological University, Singapore, and has been working on interconnect reliability for more than 10 years. He has published more than 150 technical papers in this area. His work includes the numerical modeling of interconnect reliability, reliability physics of interconnects, testing methodologies of interconnect reliability, failure analysis of interconnects, and statistical analysis of interconnect reliability data. He has trained several research staff in this area, including research fellows, research associates, PhD students and industrial engineers. He has had published a 173-page review article on electromigration in the Material Science and Engineering Review, and is the sole author of the book Electromigration in ULSI Interconnection, published by World Scientific. He is currently IEEE Distinguished Lecturer in the area of reliability, Fellow of Singapore Quality Institute, and Senior Member of ASQ and IEEE.
ISBN-13:
9781447126416
Veröffentl:
2013
Erscheinungsdatum:
21.04.2013
Seiten:
160
Autor:
Cher Ming Tan
Gewicht:
254 g
Format:
235x155x9 mm
Serie:
Springer Series in Reliability Engineering
Sprache:
Englisch

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