Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections

Dr Tan is a member of the academic staff at the Nanyang Technological University, Singapore, and has been working on interconnect reliability for more than 10 years. He has published more than 150 technical papers in this area. His work includes the numerical modeling of interconnect reliability, reliability physics of interconnects, testing methodologies of interconnect reliability, failure analysis of interconnects, and statistical analysis of interconnect reliability data. He has trained several research staff in this area, including research fellows, research associates, PhD students and industrial engineers. He has had published a 173-page review article on electromigration in the Material Science and Engineering Review, and is the sole author of the book Electromigration in ULSI Interconnection, published by World Scientific. He is currently IEEE Distinguished Lecturer in the area of reliability, Fellow of Singapore Quality Institute, and Senior Member of ASQ and IEEE.