Handbook of Materials Failure Analysis

Handbook of Materials Failure Analysis: With Case Studies from the Electronics Industries examines the reasons materials fail in certain situations, including material defects and mechanical failure as a result of various causes. The book begins with a general overview of materials failure analysis and its importance. It then proceeds to discussions on the types of failure analysis, specific tools and techniques, and an analysis of materials failure from various causes. As failure can occur for several reasons, including materials defects-related failure, materials design-related failure, or corrosion-related failures, the topics covered in this comprehensive source are an important tool for practitioners.

Part 1: Electronics Industries 1. Failures of Electronic Devices: Solder Joints Failure Modes, Causes and Detection Method 2. Electron-beam Radiation Damage and the Technical Solutions for Materials Failure Analysis of Electron-beam Sensitive Materials in Modern Semiconductor Industry 3. Failure of intermetallic solder ball due to stress shielding and amplification effects 4. Assessment of the indoor corrosion in consumer electronics in subtropical climates. 5. Pb-free Solder - Microstructural, Material Reliability and Failure Relationships 6. The Role of Contamination in Failures of Electronics - Case Studies 7. Reliability analysis of vibrating electronic assemblies using analytical solutions and response surface methodology 8. Stress Analysis of Stretchable Conductive Polymer for Electronics Circuit Application 9. New methodology for qualification and lifetime assessment of electronic systems